Ray Tech is expanding industrial X-ray inspection operations across India. Its new Chennai centre supports electronics inspection while the company evaluates local manufacturing and further capacity investment.
Nagoya researchers cut contact resistance in thin p-type gallium nitride. An ultrathin magnesium layer and short anneal preserve surface quality while improving current injection.
Teledyne FLIR will develop next-generation thermal sensors for US Army. The DUTCH programme targets better uncooled imaging performance, lower SWaP-C, and scalable domestic production.
ROHM has expanded availability of fourth-generation 650V automotive IGBTs globally. The family combines lower conduction loss, short-circuit tolerance, and AEC-Q101 qualification for auxiliary vehicle and industrial drives.
Kyoto researchers have demonstrated silicon-carbide transistors operating reliably above 600°C. Bottom-gate and double-well structures improve threshold control and suppress high-temperature leakage in extreme-environment electronics.
Texas Instruments has released multiaxial sensing for traction inverter applications. TMCS2100-Q1 combines coreless construction with two-axis magnetic measurement to reduce displacement and crosstalk errors.
Navitas will acquire Claros to extend processor-level power delivery capabilities. The deal adds vertical regulation, mixed-signal design, digital control, and advanced packaging expertise for increasingly power-dense AI processors.
Primemas has detailed rack-scale CXL memory for demanding PNNL workloads. The Abaco project combines high-density controller silicon, Micron DDR5, and memory pooling to exceed 100TB per rack.