Category: News
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AWS and NVIDIA will deploy two million additional GPUs globally. The programme extends through Blackwell Ultra, Rubin and Rubin Ultra hardware, Vera CPUs, NVLink Fusion, custom high-bandwidth memory, government infrastructure, and robotics.
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SK hynix has broken ground on its Indiana HBM facility. The $4 billion project combines advanced packaging, testing, and an R&D testbed, with cleanroom opening targeted for 2028 and mass production in 2029.
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Lam Research has started building its new Oregon semiconductor laboratory. The 120,000ft² project expands cleanroom capacity, deposition and etch development, materials work, and hardware validation.
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Keysight software has more than halved AttoTude’s IC design cycles. The EDA workflow supports RF-to-THz silicon development, first-pass tape-outs, and per-lane interconnect designs reaching 800G.
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Philips has secured funding for robotic stroke intervention development work. The programme combines image-guided therapy, steerable robotics, and AI-enabled automation to extend specialist thrombectomy capability.
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Kitron has opened new electronics manufacturing capacity in southern Norway. The 7,500m² Longum plant supports rising defence and aerospace demand while expanding high-reliability production close to European customers.
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PewCB has introduced a desktop system for rapid PCB prototyping. PewCB One combines laser ablation, prepared two-sided ceramic blanks, and stencil cutting to shorten hardware iteration cycles.
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Aetina will support NVIDIA’s new Jetson Orin Nano 2 platform. The 78 TOPS module targets compact robotics, vision systems, and multimodal edge AI within constrained power budgets.
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Vishay has expanded automotive chokes for compact high-current EMC filtering. Four AEC-Q200 devices combine currents to 14A, impedance to 11kΩ, and DCR as low as 0.4mΩ.
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KYOCERA AVX has launched vibration-proof capacitors for harsh industrial environments. The AEVA and AEVB families withstand acceleration to 30g while operating at temperatures reaching 125°C.