Category: News
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Gresham has secured new RF orders supporting established US programmes. The $5.4 million bookings cover radar, electronic warfare, communications, and other mission-critical defence systems.
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AMD EPYC processors now power Kodiak’s seventh-generation autonomous truck platform. The CPUs provide 80 PCIe lanes and boost clocks reaching 4.4 GHz for latency-sensitive sensor and planning workloads.
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Photronics reported stronger semiconductor demand as delayed designs resumed production. High-end IC masks reached a record 44% of IC revenue while US and Korean capacity investments continued.
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IBM is designing a processor supporting native Arm and Z. The 2 nm chip contains 11 cores above 5.7 GHz while executing both instruction architectures within each core.
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Achronix has released JESD204C IP for high-bandwidth Speedster7t FPGA systems. The core supports 32 Gbps lanes, deterministic latency, and aggregate serial throughput reaching 1 Tbps.
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Nordson has expanded Vantage dispensing for panel-level semiconductor packaging applications. Vantage XL combines thermal control, alignment, confocal height sensing, and inspection for larger-format advanced packaging processes.
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Celera has raised $30 million for analogue design automation expansion. The Series B will support product development, customer programmes, and engineering growth in California and Portugal.
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Trymax has secured equipment orders supporting AOI’s InP laser production. The systems will handle plasma ashing and UV curing as AOI expands high-speed optical transceiver capacity in Texas.
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Infineon is supplying CoolSiC MOSFETs for Fox ESS storage systems. The 1200 V devices cut switching losses by 70%, lifting PQ3-Ultra peak inverter efficiency to 98.78%.
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Wireless Logic will demonstrate SGP.32 IoT eSIM management in London. The Microelectronics UK session will examine remote provisioning, profile switching, and resilient connectivity across distributed device fleets.