Farnell has added Lovato Electric’s automation and protection hardware to its industrial portfolio, bringing contactors, switch disconnectors, motor-protection relays, safety devices, signalling products, and circuit-protection components into a broader stocked channel for control and power applications.
ASML posted €8.8 billion in first-quarter net sales and lifted its full-year outlook, reinforcing how AI-driven fab investment is continuing to shape lithography demand.
Nordson Electronics Solutions has taken the 2025 EM Asia Best Supplier of the Year award, adding further weight to its position in Asian electronics manufacturing equipment markets spanning dispensing, coating, selective soldering, and plasma treatment.
TPK and ASE are moving into through-glass via packaging with a pilot line planned for the third quarter of 2026, adding another sign that glass-core substrates are edging closer to practical deployment in high-performance semiconductor packaging.
Navitas has unveiled direct 800V-to-6V power delivery for AI racks. Its new GaN-based board removes the 48V stage and targets higher efficiency, density, and board-level integration.
March exposed where power in electronics now truly sits globally. Silicon still set the pace, but memory, power, optics, packaging, and design infrastructure increasingly shaped who could build, ship, and scale.
CEA and PSMC are combining photonics, RISC-V, and 3D packaging. The tie-up brings silicon photonics, microLED links, and open compute IP into interposer-based AI architectures aimed at easing bandwidth and power constraints.
SmartRay has brought reflective-surface inspection into its ECCO X family.