Rohde & Schwarz has won a $4.9bn FAA contract to replace analogue air traffic control communications infrastructure with its CERTIUM Voice Communication System across US airports and ATC facilities.
Siemens and TSMC have expanded their collaboration on AI-enabled semiconductor design automation, targeting advanced-node development, physical verification, DRC fixing, 3D IC design, and silicon photonics workflows.
ASMPT has updated WORKS Monitoring with deeper SMT-line data visibility. The new release adds more granular filtering, richer visualisation, and earlier deviation detection across live production environments.
Microchip has launched the MD-990-0011-B family of plug-in timing modules for data-centre servers and 5G vRAN platforms. The modules combine holdover, synchronisation, and environmental support functions on one card.
Rambus has introduced a SOCAMM2 chipset for LPDDR5X-based AI server modules. The launch adds local power regulation, thermal telemetry, and configuration support to the emerging modular server-memory format.
Leonardo DRS has introduced a maritime counter-UAS capability for autonomous surface vessels. The package combines sensors, mission electronics, and effectors in a modular architecture for naval operations.
Antaira Technologies has achieved SEMI E187 certification for industrial switch solutions used in semiconductor manufacturing, underlining the rising importance of embedded cybersecurity controls inside fab infrastructure.
Infineon is contributing manufacturing and engineering expertise to three European quantum pilot-line projects, linking quantum device research more directly with industrial semiconductor processes and scale-up.
EIZO Rugged Solutions has launched a 24.1-inch rugged LCD monitor for ECDIS, radar, and integrated bridge navigation roles in naval and maritime systems.
SEMI is using its June policy forum in Brussels to push for a more comprehensive Chips Act 2.0, with the agenda moving beyond fab announcements toward resilience, competitiveness, skills, security, and the harder work of building a durable European semiconductor ecosystem.