Category: Industrial
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Tessalia will produce advanced SiP components in France. The Foxconn, Radiall, and Thales joint venture targets aerospace, telecoms, automotive, and medical applications, with production planned from 2029 and annual output above 50 million components by 2033.
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Eatron and NEXTY Electronics are moving battery-monitoring projects into commercial deployment. Their platform combines AI and physics-based models for battery health, safety diagnostics, and lifecycle prediction.
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QPT has opened customer demonstrations of MicroDyno. The GaN motor-drive platform now adds field-oriented control, dynamic cogging correction, digital-twin modelling, and edge-AI fault detection.
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CSG has won two NATO customer contracts for fuzes. The orders cover mechanical and electronic fuzes for large-calibre ammunition, with electronic fuze production involving Fuchs Electronics Europe in Slovakia.
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Intel has expanded its data-centre processor and networking stack. Xeon 6+ processors, Ethernet E835 controllers, and Crescent Island GPU updates target AI, cloud, edge, and network-intensive infrastructure.
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Siemens has developed an AI data-centre reference design. The architecture covers electrical distribution, controls, modular power blocks, storage integration, and scalable deployment for NVIDIA Vera Rubin NVL72 infrastructure.
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ST has launched a vibration sensor for industrial condition monitoring systems. The IIS3DWB10IS combines MEMS sensing, wide-bandwidth measurement, and local AI processing for predictive maintenance applications.
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A.R.T. and Space East will host a UK space-electronics event.
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Pickering will show EV test systems for battery electronics validation.
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Molex has introduced liquid-cooled busbars for high-current AI racks globally.