Category: Industrial
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Mouser is shipping TDK’s AMT45S pulse transformer for EV charging. The compact component targets power line communication circuits used in CCS and NACS charging systems, supporting isolation, signal integrity, and charging control.
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EnSilica has secured a seven-year automotive semiconductor supply contract. The UK fabless chipmaker will manufacture and supply an Arm-based sensing device already in production for a German automotive components customer.
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SemiQ will show expanded SiC power modules at PCIM Europe. The portfolio includes QSiC Dual3 devices, AlN substrate options, pre-applied thermal interface material, and high-current packages for AI infrastructure, EV charging, storage, solar, and industrial drives.
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Siemens and HighByte are tightening industrial AI data integration workflows. The partnership brings HighByte Intelligence Hub into Siemens Industrial Edge, giving manufacturers a structured route from PLC, SCADA, MES, and enterprise data into AI-ready industrial applications.
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Marktech has expanded its COTS and custom photodetector and LED capabilities with transfer-moulded packaging technology. The platform targets defence and aerospace sensing, targeting, and optical alignment systems requiring compact, rugged, and repeatable optoelectronic packages.
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Astute Group has added UK stock of ATS thermal management products for NVIDIA Jetson modules. The range covers active heatsinks, passive options, and thermal transfer plates for robotics, edge computing, smart monitoring, and physical AI systems.
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Infineon has integrated its OPTIGA TPM SLB 9672 with NVIDIA Jetson Thor. The hardware root of trust secures keys, verifies software integrity, and supports post-quantum update protection for physical AI systems and robot fleets.
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ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.
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JEDEC has released JEP203 and JEP204 for silicon carbide power semiconductors. The documents cover short-circuit evaluation and stress procedures, supporting more consistent qualification of SiC devices in EVs, industrial drives, renewable systems, and high-power electronics.
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Bull and Foxconn will manufacture AI and cloud infrastructure across France and the Czech Republic. The partnership targets AI factories, neo-cloud providers, enterprises, and research institutions, with an initial investment expected to exceed €120m.