Category: Markets
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IOxOS is applying modular FMC architecture to scalable radar frontends. VITA 57.1 separates FPGA processing from replaceable converter and sensor-interface hardware for easier system reconfiguration.
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Micross plans AEMtec acquisition to expand European packaging and testing. The proposed deal adds advanced assembly, optoelectronics, wafer back-end services, and cleanroom manufacturing in Germany.
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Silex has launched an i.MX 95 module for edge AI. The EP-200N combines heterogeneous processing, industrial interfaces, wireless integration, and extended-temperature operation for embedded OEM designs.
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Solinide has raised €4 million to scale silicon-nitride photonics production. The Swedish company is commercialising microcomb sources for lower-power optical interconnects in AI infrastructure.
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TekSiC has advanced European semi-insulating silicon carbide wafer supply efforts. GaN epitaxy has now been grown on the Swedish wafers ahead of RF and power HEMT validation.
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TE Connectivity has launched its SCHRACK RSY industrial relay family. The compact PCB platform combines 10A switching, extended thermal operation, low-load contact reliability, and a lower product carbon footprint.
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Vector has added AI-agent workflows to CANoe automotive testing software. CANoe 20 SP2 can generate tests, execute them, diagnose failures, modify code, and repeat validation from natural-language instructions.
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India’s C2S programme has expanded practical semiconductor design training nationwide. More than 68,000 students have been trained, while 254 chip designs have reached tape-out.
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Aitech has launched a rugged SOSA-aligned Ethernet switch for defence. U-C6850 provides up to 320Gbps switching, 10/40GbE interfaces, Layer 2/3 networking, and precision timing.
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CACI has opened expanded defence electronics manufacturing capacity in Rochester. The 61,000ft² facility adds more than 300% manufacturing space for software-defined electronic warfare programmes.