HANZA is consolidating selected Finnish electronics production at Oulainen facility. Remaining Nivala and Sievi operations will pass to local management through a buyout.
Rohde & Schwarz combines fast capture with mixed-domain EMC debugging. The MXO 3 links waveform acquisition, spectrum analysis, and high-resolution measurements for earlier fault isolation.
Spain is connecting domestic semiconductor research, design, and manufacturing projects. The programme spans RISC-V chiplets, analogue IP, prototyping, materials, and edge processing.
Infineon and LS Electric will develop high-efficiency DC power systems. Their programme covers energy storage, solid-state transformers, fast protection, and AI data-centre infrastructure.
Germany will provide €659m for four new semiconductor manufacturing projects. The plants cover silicon carbide wafers, power MOSFETs, production metrology, and radiation detectors.
Intel will invest €5bn to expand processor manufacturing at Leixlip. The programme adds Intel 3 capacity, equipment, automation, and cleanroom utilisation for Xeon 6 and later products.
ADIOS now lists almost seven hundred thousand current components online. The UK distributor is expanding stocked inventory, supplier auditing, and component verification as purchasing teams seek alternatives to increasingly consolidated authorised channels.