Synopsys reported stronger quarterly growth led by Design Automation sales. Third-quarter revenue reached $2.477 billion as EDA, Ansys engineering software, and design IP supported higher full-year expectations.
Beijing has launched an atomic-scale manufacturing programme for advanced semiconductors. The 2026–28 plan covers etch, deposition, implantation, process software, precision equipment, metrology, pilot facilities, and industrial demonstration.
Beijing has launched a three-year AI4Chip semiconductor industry development programme. The plan applies artificial intelligence across IC design, wafer fabrication, packaging, test, equipment, materials, and supporting engineering infrastructure.
AWS and NVIDIA will deploy two million additional GPUs globally. The programme extends through Blackwell Ultra, Rubin and Rubin Ultra hardware, Vera CPUs, NVLink Fusion, custom high-bandwidth memory, government infrastructure, and robotics.
SK hynix has broken ground on its Indiana HBM facility. The $4 billion project combines advanced packaging, testing, and an R&D testbed, with cleanroom opening targeted for 2028 and mass production in 2029.
Lam Research has started building its new Oregon semiconductor laboratory. The 120,000ft² project expands cleanroom capacity, deposition and etch development, materials work, and hardware validation.
Philips has secured funding for robotic stroke intervention development work. The programme combines image-guided therapy, steerable robotics, and AI-enabled automation to extend specialist thrombectomy capability.
Kitron has opened new electronics manufacturing capacity in southern Norway. The 7,500m² Longum plant supports rising defence and aerospace demand while expanding high-reliability production close to European customers.