Category: Markets
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Aetina will demonstrate edge AI systems for robotics, vision AI, cable assembly, and on-premise agentic workflows at COMPUTEX 2026.
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Infineon is coordinating Moore4Power, a €91m European project focused on heterogeneous integration for next-generation smart power electronics.
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University of Arizona researchers have developed a 3D imaging approach that uses surrounding matte surfaces as a virtual screen for reflective objects.
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Vishay has introduced automotive-grade optocouplers with wider creepage and clearance distances for EV, solar inverter, and high-voltage isolation stages.
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Nvidia has reported record first-quarter revenue of $81.6bn, as AI infrastructure demand continues to reshape processor, memory, networking, and power design.
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ByteSnap and Digi are extending embedded Linux security support into SBOM-led compliance for long-life medical and industrial IoT devices.
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Pickering will present modular RF and microwave switching systems at IMS 2026, including PXI/PXIe modules up to 110GHz.
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ATGBICS has developed a fly-by-fibre transceiver approach for defence drones operating in environments where wireless control links are degraded or denied.
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HighTec and SiFive are combining qualified compiler tooling with RISC-V processor IP to support safer automotive and industrial software development.
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Innodisk has introduced a 10GbE LAN module portfolio for edge AI systems, combining M.2 and PCIe form factors with Intel Ethernet controllers, DPDK, PTP, SR-IOV, and wide-temperature options.