Category: Markets
-
Microchip’s LX4580 consolidates actuation sensing and control into one IC. The 24-channel mixed-signal device targets aviation and defence actuators with redundant architecture, multi-sensor interfaces, and evaluation tools to cut board size, wiring, and integration effort.
-
Teledyne releases wideband limiter to protect EW receiver front-ends hardware. The passive 0.1–20 GHz module is built to absorb high-power RF before it reaches sensitive electronics, with SMA connectors and fast recovery aimed at retrofit protection in R-ESM and EW systems.
-
ifm’s O6D100 tackles black, reflective objects in tight spaces reliably. The PMD time-of-flight distance sensor targets logistics, robotics, and assembly automation, pairing a 3 m range with selectable speed and precision modes over IO-Link for fast retrofits.
-
Sony brings drone-ready cameras and LiDAR to Amsterdam Drone Week. The company plans live demonstrations spanning 61MP aerial imaging, 4K60 zoom blocks, and miniature dToF depth sensing for mapping, inspection, surveillance, and traffic operations.
-
XPENG is advancing VLA 2.0 and updating European vehicles now. Global delivery of the next-generation vision-to-action driving stack is planned from 2027, while XOS 5.8.7 begins rolling out in Europe this month with refinements to ACC, lane centring, and connectivity.
-
Delta has acquired its German building automation integration partner outright. The deal folds Delta Controls Germany’s European integrator network into Delta’s smart-building portfolio, as building automation and control requirements tighten across the region.
-
Intelligent Memory is reviving low-density eMMC for long-life industrial designs. The company has launched 8GB and 16GB industrial eMMC in a 153-ball BGA package, aiming to keep embedded platforms supplied as mainstream vendors reduce legacy capacity options.
-
L3Harris says additive manufacturing is reshaping airbreathing hypersonic propulsion production. The company reports a tenfold reduction in 3D-printed component lead times under a US DoD manufacturing programme.
-
Rutronik is stocking ADLINK’s cExpress-R8 COM Express edge modules now. The 95 mm × 95 mm Type 6 design combines Ryzen Embedded 8000 compute and an integrated NPU, with up to 96 GB DDR5 and PCIe Gen4 expansion.
-
Nordson will showcase coating and soldering systems at APEX 2026. In Anaheim, the company plans live demonstrations focused on process control, traceability, and higher-yield PCB assembly, including updates to its ASYMTEK Select Coat platform and its SELECT Synchro selective soldering line.