Category: Markets
-
QPT has launched qDesign for AI-optimised power module packaging workflows.
-
ODU has supplied mass interconnects for automated DEIF converter testing.
-
Fraunhofer IAF is demonstrating GaN power modules for bidirectional charging.
-
Infineon will supply SiC modules for Siemens semiconductor circuit breakers.
-
Mouser is shipping TDK’s AMT45S pulse transformer for EV charging. The compact component targets power line communication circuits used in CCS and NACS charging systems, supporting isolation, signal integrity, and charging control.
-
EnSilica has secured a seven-year automotive semiconductor supply contract. The UK fabless chipmaker will manufacture and supply an Arm-based sensing device already in production for a German automotive components customer.
-
Semiconductor equipment billings hit a new quarterly record in 2026. SEMI’s Q1 figures show capital spending concentrated around leading-edge logic, DRAM, and advanced packaging as AI infrastructure keeps pulling investment towards wafer fabrication and package-level integration.
-
Vox Power has added digital outputs to NEVO+ supplies. The PMBus-compatible modules bring rail-level monitoring, sequencing, set-point control, fault visibility, and development-kit support to compact configurable AC-DC power systems.
-
Europe is reshaping mobile satellite services beyond 2027. The proposed framework would divide the harmonised 2GHz MSS band between governmental, security, defence, critical communications, and commercial direct-to-device satellite services.
-
Microchip’s Armenian engineering team has gained advanced FPGA authorisation. The US export licence covers controlled semiconductor technology and related high-performance hardware, allowing approved engineers to work on selected FPGA programmes under defined compliance controls.