Category: Markets
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ROHM has developed the ML7670 and ML7671 NFC wireless power chipset for compact wearables, including smart rings, smart bands, and smart pens.
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onsemi and Geely Auto Group have expanded their collaboration around EliteSiC power technologies for next-generation electric and hybrid vehicle platforms.
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Amphenol RF has expanded its non-magnetic MCX connector series with new configurations for medical equipment, quantum computing hardware, and wireless modules.
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Teledyne FLIR Defense has certified Emesent’s Hovermap LiDAR payload for unmanned air, ground, and radiation-detection platforms, adding GPS-denied 3D mapping capability.
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Rohde & Schwarz will show new high-gain antennas and speed-optimised EMI testing at APEMC 2026, targeting commercial, automotive, aerospace, and defence compliance work.
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POLYN Technology has taped out its VibroSense engineering chip, bringing analogue neuromorphic processing closer to deployment inside tyres for real-time road-friction monitoring.
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Microchip has expanded its Trust Shield portfolio with the TS1800 Platform Root of Trust controller and TS50x secure boot controller, adding hardware-accelerated post-quantum cryptography for data centre, compute, defence, telecom, and infrastructure systems.
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Analog Devices has released its A²B 2.0 automotive audio bus devices to production, increasing full-duplex bandwidth to 98.3Mbps and adding Ethernet tunnelling support for next-generation in-vehicle audio and connectivity architectures.
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MIKROE has added Renesas RA2E1 MCU support to mikroSDK 2.17.12, extending its embedded development framework with low-power Cortex-M23 devices, new board packages, and fixes for Renesas RA2 interrupt handling.
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Valeo and Infineon are collaborating on a laser beam-scanning ground projection module that uses 2D MEMS mirror technology for vehicle-to-everything communication, road-safety signalling, and exterior lighting personalisation.