Richardson Electronics has added Nxbeam MMICs to its RF portfolio. A global agreement broadens access to GaN and GaAs devices up to 76 GHz for radar, satcom, and test equipment designs.
Renesas has pushed Wi-Fi 6 into its RA6 combo MCUs. The RA6W1 and RA6W2 integrate Ceva wireless IP to reduce external radios, simplify PCB layouts, and cut BOM cost for IoT designs.
EnSilica joins the CHERI Alliance to harden custom ASICs today. The mixed-signal supplier says it will use CHERI capability-based hardware techniques to strengthen memory safety for automotive and industrial silicon.
Rohde & Schwarz has pushed mid-range spectrum analysis to 44GHz. The new FPL1044 spans 10Hz to 44GHz and adds a 40MHz real-time spectrum analysis option across the FPL family, targeting Ka-band and adjacent high-frequency test workloads.
Edinburgh team reports a recoverable hexagonal germanium–tin semiconductor class today. The group used extreme pressure and heat to create stable GeSn alloys that could improve light–electricity conversion in optoelectronic components for processors, imaging systems, and data-centre hardware.
TDK-Lambda has introduced a 1U 3.5kW hot-swap supply for industry. The HFE3500 series supports redundant rack configurations and parallel operation, targeting automation, ATE, and communications systems that need high-density bulk power with monitoring and control via PMBus.