Synopsys has rolled out a complete UFS 5.0, UniPro 3.0, and M-PHY v6.0 IP solution for next-generation storage, combining protocol, link, and physical layers in a single stack as edge-AI and automotive SoCs push storage bandwidth into a system-level constraint.
AMD has signed a new letter of intent with the French government to expand AI infrastructure, training, and ecosystem support, while reinforcing its role in Alice Recoque, France’s planned first exascale supercomputer and a central platform in the country’s wider AI strategy.
TDK-Lambda has launched a 1500W AC-DC module series aimed at industrial, lighting, and building automation equipment, combining a wide 85-305 Vac input range with PMBus control, sealed-enclosure suitability, and support for parallel operation in higher-power designs.
NVIDIA has launched its Ising model family for quantum calibration and error-correction decoding, signalling a deeper push into the classical computing layer around quantum systems.
DELO has added five IBOA- and TPO-free adhesives for medical electronics, targeting wearable housings, sensor potting, sealing, and process control in compact device assemblies.
A UK-built life-science payload on the ISS combines fluorescence imaging, environmental sensing, and remote operation to study how biology responds to microgravity and radiation.
EPC has introduced 5kW three-phase GaN inverter boards for BLDC motor control, targeting robotics, industrial automation, forklifts, light EVs, and other motion systems that benefit from faster switching and higher power density.
Raytheon has demonstrated an event-based mid-wave infrared camera that tracks motion at pixel level rather than by processing full frames, cutting data load and power demand in high-speed sensing applications.