Delta is bringing a tightly integrated electronics stack to LogiMAT. Charging, 3D time-of-flight vision, motion control, industrial computing, and robotics are being shown as one coordinated intralogistics platform.
MARS Bioimaging has secured FDA clearance for portable photon-counting CT. The decision opens the US market for a compact upper-extremity imaging system built around detector technology originally developed through CERN’s Medipix3 work.
Leankon has widened its NFC antenna range to nine modules. The expanded 13.56 MHz line packages ferrite-backed, connector-ready options into a broader off-the-shelf portfolio for healthcare, access control, and industrial IoT hardware.
Teradyne is pushing board test further into AI server manufacturing. Omnyx combines structural, parametric, high-speed interconnect, and operational test in one platform for complex data-centre hardware.
Europe’s ferroelectric memory push has reached an important manufacturing test. CEA-Leti and Fraunhofer IPMS have completed the first wafer exchange inside the FAMES pilot line for HZO-based memory stacks.
TI is compressing AI rack power delivery into two stages. The architecture tracks NVIDIA’s 800 VDC roadmap and pushes higher density, fewer conversions, and lower copper overhead into the datacentre power chain.
Coherent is scaling InP photonics for faster AI data links. Its OFC 2026 lineup spans lasers, modulators, photodiodes, and subsystems aimed at 1.6T and 3.2T optical architectures.
Samsung and AMD tighten HBM4 planning around rack-scale AI systems. Their expanded agreement links next-generation high-bandwidth memory supply to future Instinct accelerators, where bandwidth, packaging, power, and platform integration are now moving together.
UK lighting faces rising WEEE scrutiny as marketplace data deepens. Fresh reporting is sharpening the scale of non-compliance across online lighting sales, increasing pressure on registration, traceability, classification, and end-of-life obligations.