Infineon is packing more current into the AI power stage. Its latest TLVR module targets the growing board-level constraints inside AI servers, where power density, transient response, and thermal headroom are becoming central design limits.
RANsemi has secured a tactical 5G baseband design win now. Its RNS802 SoC sits at the heart of Apeiroon’s deployable 4G and 5G systems for defence, public safety, and temporary private networks.
Taoglas is shrinking multi-radio antenna integration into tighter device footprints. Its new FXP30x and PC30x families combine cellular, GNSS, and Wi‑Fi support in flexible and rigid PCB formats for compact connected products.
AI hardware efficiency is pushing materials science back into focus. Cambridge researchers have developed a hafnium oxide memristor that could cut energy use in analogue in-memory computing.
Sensor authenticity is becoming a hardware problem, not software alone. ETH Zurich has built a chip that signs data at capture to help expose manipulated media.
Programmable photonics is edging closer to practical semiconductor deployment. Lumotive’s new 2D beamforming chip points to flatter optical architectures for sensing, communications, and AI data-centre networking.
Semiconductor education is shifting toward lab-ready workflows and measurement discipline. Keysight’s new university packages bring device test, on-wafer analysis, and photonic IC measurement into structured teaching labs.
Cooling hardware is tightening efficiency as AI data-centre loads rise. Delta’s latest ErP 2026-compliant EC fans at MCE 2026 target lower-power, lower-harmonic thermal management for data-centre and HVAC deployments.
Infineon and DG Matrix are pushing silicon carbide further upstream. Their collaboration puts SiC devices into solid-state transformer platforms aimed at AI data centres and industrial power infrastructure.