iDEAL Semiconductor will showcase SuperQ silicon MOSFET technology at PCIM. The architecture targets lower conduction and switching losses while keeping designers within familiar silicon manufacturing, packaging, and qualification routes.
ROHM has released a web-based PLECS simulator that allows power electronics designers to evaluate losses, temperature rise, waveforms, and device selection during early circuit development.
Nexperia will use Polar Semiconductor’s Minnesota wafer facility to manufacture next-generation power MOSFETs, strengthening supply for AI infrastructure, robotics, industrial, and automotive applications.
Microchip has introduced 3.3kV SiC power modules for solid-state transformers, AI data centres, megawatt charging, rail, medium-voltage drives, and industrial power systems.
The European Commission has selected 65 electrified industrial heat projects for around €400m of support, creating further demand for power conversion, controls, and sensing technologies.
STMicroelectronics has added seven 700V PowerGaN devices for high-density industrial power conversion, targeting AI servers, robotics, smart-grid converters, and solar inverters.
Wolfspeed has introduced two 3.3 kV silicon carbide power module families for AI data centres, renewable energy, storage, and high-voltage conversion infrastructure.
Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch family with two devices designed to reduce PCB area and component count in compact power-path designs.
WireFlow has introduced its 5200 series battery monitoring and balancing system, combining a 12-channel node with USB and EtherCAT gateways for EV, ESS, laboratory, and industrial battery test environments.