Category: Power supplies
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Infineon will use PCIM Europe 2026 to present silicon, SiC, and GaN technologies for AI data centres, robotics, solid-state power infrastructure, energy storage, and electromobility.
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Infineon is coordinating Moore4Power, a €91m European project focused on heterogeneous integration for next-generation smart power electronics.
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Vishay has introduced automotive-grade optocouplers with wider creepage and clearance distances for EV, solar inverter, and high-voltage isolation stages.
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Nvidia has reported record first-quarter revenue of $81.6bn, as AI infrastructure demand continues to reshape processor, memory, networking, and power design.
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AI server growth is putting renewed pressure on high-capacitance MLCC availability, pulling passive components back into design and sourcing risk.
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Melexis has introduced an 18-channel LIN RGB LED controller with an integrated 1A DC/DC converter for compact automotive lighting modules.
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Analog Devices will acquire Empower Semiconductor for $1.5bn, adding integrated voltage-regulator and silicon-capacitor technologies for high-density AI compute power delivery.
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TDK will use PCIM Europe 2026 to show passive components, sensors, contactors, µPOL converters, and power-stage technologies for AI data centres, electrification, industrial drives, and EV infrastructure.
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Allegro MicroSystems will demonstrate current sensing and isolated gate-driver technologies at PCIM 2026, targeting SiC and GaN power designs for AI data centres and 800V EV architectures.
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TDK’s FS3303 micro POL module delivers 3A in a 2.5mm x 2.5mm footprint, targeting optical modules, AI edge systems, ASICs, SoCs, DSPs, and dense low-voltage rails.