Rambus has introduced a DDR5 9600 client memory module chipset for CUDIMM, CQDIMM, and CSODIMM designs in future AI PCs, workstations, and notebooks.
Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.