Category: Processors
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Rutronik is stocking ADLINK’s cExpress-R8 COM Express edge modules now. The 95 mm × 95 mm Type 6 design combines Ryzen Embedded 8000 compute and an integrated NPU, with up to 96 GB DDR5 and PCIe Gen4 expansion.
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ST’s Stellar P3E MCU integrates dedicated neural acceleration on-chip hardware. The automotive controller uses a Neural-ART Accelerator to run edge inference and virtual sensing alongside safety-focused real-time cores for software-defined vehicle platforms.
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Industrial touchscreens have stripped tactile feedback from many HMIs today. Ross Turnbull, Director of Business Development at Swindon Silicon Systems, explains how custom ASICs enable precise, closed-loop haptics that makes digital panels feel more like physical controls.
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Edinburgh team reports a recoverable hexagonal germanium–tin semiconductor class today. The group used extreme pressure and heat to create stable GeSn alloys that could improve light–electricity conversion in optoelectronic components for processors, imaging systems, and data-centre hardware.
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Microchip has broadened its Cortex-M0+ microcontroller range again today, globally. The new PIC32CM PL10 family targets 5 V, noise-tolerant embedded control, with pin compatibility intended to ease migration from AVR Dx designs in industrial, appliance, and automotive subsystems.
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Microsoft has detailed Maia 200, its latest inference accelerator silicon. Built on TSMC 3nm, the chip pairs FP8/FP4 tensor cores with 216GB HBM3e, targeting higher token-throughput per watt in Azure-scale deployments.
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Samsung has placed an Intel Xeon 6 vRAN call successfully. The companies say a live-network commercial call ran on Samsung’s cloud-native vRAN using Intel’s Xeon 6700P-B series, targeting higher consolidation and better power efficiency for virtualised RAN deployments.