Category: Processors
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RANsemi has secured a tactical 5G baseband design win now. Its RNS802 SoC sits at the heart of Apeiroon’s deployable 4G and 5G systems for defence, public safety, and temporary private networks.
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AI hardware efficiency is pushing materials science back into focus. Cambridge researchers have developed a hafnium oxide memristor that could cut energy use in analogue in-memory computing.
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Programmable photonics is edging closer to practical semiconductor deployment. Lumotive’s new 2D beamforming chip points to flatter optical architectures for sensing, communications, and AI data-centre networking.
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Camera intelligence is moving on-device as edge silicon gets leaner. Hailo is using ISC West 2026 to push low-memory, low-power AI vision deeper into mass-market security designs.
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Mythic is hardening analog AI around foundry-ready embedded memory technology. Its next APU generation will use SST’s memBrain and SuperFlash to push compute-in-memory efficiency further into deployable silicon.
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SolidRun has pushed edge AI deeper into embedded compute. Its new COM Express Type 6 modules pair AMD’s Ryzen AI Embedded P100 with LP-CAMM2 memory and up to 59 TOPS for harsh-environment deployments.
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Texas Instruments has launched two MCU families with integrated TinyEngine neural processing units, targeting low-cost edge AI inference and intelligent real-time motor-control applications.
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AMD has expanded Ryzen AI Embedded for heavier edge workloads. The new P100 variants are aimed at consolidated industrial, robotics, and imaging systems.
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Safety-certified RISC-V development is edging closer to productisation now globally. MIPS and Green Hills have combined processor IP, RTOS, tools, and analysis software into a Safety SDK targeting ASIL-D and SIL 3/4 systems.
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ROHM is bringing TSMC GaN process know-how into Hamamatsu plant. The company plans an end-to-end in-group production system by 2027, targeting demand from AI server power supplies and EV on-board chargers.