Rambus has launched new HBM4E controller IP for accelerator designs. The block targets AI and HPC devices that need much higher memory bandwidth, with early-access licensing now open.
Infineon is packing more current into the AI power stage. Its latest TLVR module targets the growing board-level constraints inside AI servers, where power density, transient response, and thermal headroom are becoming central design limits.
RANsemi has secured a tactical 5G baseband design win now. Its RNS802 SoC sits at the heart of Apeiroon’s deployable 4G and 5G systems for defence, public safety, and temporary private networks.
AI hardware efficiency is pushing materials science back into focus. Cambridge researchers have developed a hafnium oxide memristor that could cut energy use in analogue in-memory computing.
Programmable photonics is edging closer to practical semiconductor deployment. Lumotive’s new 2D beamforming chip points to flatter optical architectures for sensing, communications, and AI data-centre networking.
Mythic is hardening analog AI around foundry-ready embedded memory technology. Its next APU generation will use SST’s memBrain and SuperFlash to push compute-in-memory efficiency further into deployable silicon.
Texas Instruments has launched two MCU families with integrated TinyEngine neural processing units, targeting low-cost edge AI inference and intelligent real-time motor-control applications.