CGD and NXP are collaborating on GaN power-conversion system designs. The work targets data-centre, automotive, and industrial designs needing higher efficiency and density.
CSA Catapult will become the UK’s Semiconductor Catapult this summer. The transition broadens support for chip R&D, validation, commercialisation, and AI hardware deployment.
Cicor has secured a major French defence electronics assembly programme. The award gives its French operation new electronic assembly work with revenue potential above €50m.
Celera has acquired SiliconGate to expand analogue IC design capability. The deal adds Portuguese power-management expertise, silicon-proven IP, and design capacity for custom semiconductor development.
Siemens has launched Solido Characterizer for semiconductor library characterisation workflows. The software combines predictive AI and an AI-accelerated SPICE simulator to reduce Liberty file generation from weeks to days.
Semiconductor equipment billings hit a new quarterly record in 2026. SEMI’s Q1 figures show capital spending concentrated around leading-edge logic, DRAM, and advanced packaging as AI infrastructure keeps pulling investment towards wafer fabrication and package-level integration.
ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.
Bull and Foxconn will manufacture AI and cloud infrastructure across France and the Czech Republic. The partnership targets AI factories, neo-cloud providers, enterprises, and research institutions, with an initial investment expected to exceed €120m.