Category: Electronics
-
Tessalia will produce advanced SiP components in France. The Foxconn, Radiall, and Thales joint venture targets aerospace, telecoms, automotive, and medical applications, with production planned from 2029 and annual output above 50 million components by 2033.
-
Cadence has extended ChipStack to Level-5 autonomy. The AI Super Agent uses NVIDIA technology to automate chip design and verification workflows across simulation, formal analysis, debug, and convergence.
-
Siemens has developed an AI data-centre reference design. The architecture covers electrical distribution, controls, modular power blocks, storage integration, and scalable deployment for NVIDIA Vera Rubin NVL72 infrastructure.
-
Nikon is preparing lower-cost ArF tools for semiconductor manufacturing markets.
-
LAPP will show industrial connectivity systems at Drives & Controls. The NEC exhibit will cover cabling, connectors, harnessing, EMC, OT security, and smart-factory integration.
-
University researchers have validated bidirectional DC protection using SiC modules. The architecture targets medium-voltage DC grids, battery storage, renewable integration, vehicle-to-grid systems, and industrial power infrastructure.
-
Infineon has joined NVIDIA’s MGX ecosystem for AI rack power. The collaboration supports 800VDC architectures using silicon, silicon carbide, and gallium nitride technologies to improve power delivery in high-density AI data centres.
-
Keysight has added executable workflow capture to RF design software. The RF Circuit Simulation Professional update turns simulations, optimisations, decision trees, and design parameters into reusable visual workflows and editable Python code.
-
Rambus has introduced a DDR5 9600 client memory module chipset for CUDIMM, CQDIMM, and CSODIMM designs in future AI PCs, workstations, and notebooks.
-
Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.