Category: Electronics
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Photronics reported stronger semiconductor demand as delayed designs resumed production. High-end IC masks reached a record 44% of IC revenue while US and Korean capacity investments continued.
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Nordson has expanded Vantage dispensing for panel-level semiconductor packaging applications. Vantage XL combines thermal control, alignment, confocal height sensing, and inspection for larger-format advanced packaging processes.
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Trymax has secured equipment orders supporting AOI’s InP laser production. The systems will handle plasma ashing and UV curing as AOI expands high-speed optical transceiver capacity in Texas.
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Infineon is supplying CoolSiC MOSFETs for Fox ESS storage systems. The 1200 V devices cut switching losses by 70%, lifting PQ3-Ultra peak inverter efficiency to 98.78%.
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Wireless Logic will demonstrate SGP.32 IoT eSIM management in London. The Microelectronics UK session will examine remote provisioning, profile switching, and resilient connectivity across distributed device fleets.
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Ray Tech is expanding industrial X-ray inspection operations across India. Its new Chennai centre supports electronics inspection while the company evaluates local manufacturing and further capacity investment.
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Nagoya researchers cut contact resistance in thin p-type gallium nitride. An ultrathin magnesium layer and short anneal preserve surface quality while improving current injection.
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Teledyne FLIR will develop next-generation thermal sensors for US Army. The DUTCH programme targets better uncooled imaging performance, lower SWaP-C, and scalable domestic production.
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Kyoto researchers have demonstrated silicon-carbide transistors operating reliably above 600°C. Bottom-gate and double-well structures improve threshold control and suppress high-temperature leakage in extreme-environment electronics.
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Texas Instruments has released multiaxial sensing for traction inverter applications. TMCS2100-Q1 combines coreless construction with two-axis magnetic measurement to reduce displacement and crosstalk errors.