Category: Electronics
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Q2 2026 made electronics design constraints much harder to ignore. Memory, packaging, optics, EDA automation, edge AI, and power delivery all carried forward existing pressures, while adding sharper evidence of how advanced systems are now limited by more than processors alone.
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eMaint has launched its first global maintenance partner network today. The Fluke business is formalising implementation, certification, and service support across industrial CMMS and EAM markets.
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Dynex Semiconductor has developed a high-current 650V GaN power module. The 450A half-bridge design uses PCB embedding and double-sided cooling for dense industrial power conversion.
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Oriole Networks is deploying photonic AI networking with AMD hardware. The UK startup’s PRISM platform will be tested inside ARIA’s Scaling Inference Lab for latency, throughput, and accelerator utilisation.
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Kimball Electronics has acquired Dutch medical CDMO Helvoet Polymer Technologies. The €90m deal expands micro-moulding and precision manufacturing capability for diagnostics, microfluidics, and drug delivery.
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Berlin researchers have reached certified CIGS-perovskite tandem cell efficiency records. The 25.5% result strengthens thin-film photovoltaic development where interfaces, stability, and manufacturable scale remain decisive.
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Infineon has opened its €5bn Smart Power Fab in Dresden. The site doubles local power semiconductor and analogue/mixed-signal capacity for AI infrastructure, grids, renewables, vehicles, and industrial systems.
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Vertiv has opened a Malaysian facility for AI infrastructure manufacturing. The Johor site supports power, cooling, testing, and modular deployment.
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Nightfood has signed a semiconductor automation acquisition letter of intent. The proposed deal covers Taiwan-based Jiun Jiang Enterprise and TechForce Robotics.
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FTG has opened its first Indian aerospace electronics manufacturing facility. The Hyderabad site adds cockpit, avionics, and high-reliability electronics capacity.