Category: Electronics
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CSA Catapult will become the UK’s Semiconductor Catapult this summer. The transition broadens support for chip R&D, validation, commercialisation, and AI hardware deployment.
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Cicor has secured a major French defence electronics assembly programme. The award gives its French operation new electronic assembly work with revenue potential above €50m.
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Celera has acquired SiliconGate to expand analogue IC design capability. The deal adds Portuguese power-management expertise, silicon-proven IP, and design capacity for custom semiconductor development.
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Siemens has launched Solido Characterizer for semiconductor library characterisation workflows. The software combines predictive AI and an AI-accelerated SPICE simulator to reduce Liberty file generation from weeks to days.
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Semiconductor equipment billings hit a new quarterly record in 2026. SEMI’s Q1 figures show capital spending concentrated around leading-edge logic, DRAM, and advanced packaging as AI infrastructure keeps pulling investment towards wafer fabrication and package-level integration.
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ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.
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Bull and Foxconn will manufacture AI and cloud infrastructure across France and the Czech Republic. The partnership targets AI factories, neo-cloud providers, enterprises, and research institutions, with an initial investment expected to exceed €120m.
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Tessalia will produce advanced SiP components in France. The Foxconn, Radiall, and Thales joint venture targets aerospace, telecoms, automotive, and medical applications, with production planned from 2029 and annual output above 50 million components by 2033.
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Cadence has extended ChipStack to Level-5 autonomy. The AI Super Agent uses NVIDIA technology to automate chip design and verification workflows across simulation, formal analysis, debug, and convergence.
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Siemens has developed an AI data-centre reference design. The architecture covers electrical distribution, controls, modular power blocks, storage integration, and scalable deployment for NVIDIA Vera Rubin NVL72 infrastructure.