Category: Electronics
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Microchip’s Nantes facility now supports tougher aerospace semiconductor qualification demands. Class Y capability strengthens advanced packaging routes for aerospace and defence devices.
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Semiconductor revenue reached $319bn during the first quarter of 2026. Omdia’s figures show an exceptional memory rebound, with DRAM and NAND nearly doubling as AI infrastructure demand reshapes chip-market growth.
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IQE and Tower have signed a multi-year InP epiwafer agreement. The supply deal supports silicon photonics for AI infrastructure.
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Fraunhofer has urged Germany to accelerate applied research-to-industry technology transfer. The call reflects growing pressure on industrial innovation.
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Nexperia has reported resilient first-quarter results despite supply disruption pressures. Back-end expansion is advancing in Malaysia and the Philippines.
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Imec, ASML, and TSMC have demonstrated industry-scale 2D transistor integration. The 300mm work points beyond silicon logic scaling.
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TDK has introduced B25696H DC-link capacitors for SiC converter designs. The MKP film series targets high-frequency power stages across storage, traction, renewables, and drives.
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Lantronix has partnered with Cherry and White on rapid connectivity. The platform combines rugged industrial gateways with field-deployable Wi-Fi for critical sites.
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MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
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Anritsu has introduced Tensor, an AI-assisted vector network analyser platform. The source-per-port architecture supports RF, microwave, millimetre-wave, and sub-THz characterisation.