TNO and ASML are scaling Europe’s photonic chip manufacturing base. The Eindhoven collaboration connects InP production, lithography, metrology, and process control.
Nearfield Instruments has raised €330m for semiconductor metrology expansion plans. The Dutch company is scaling inspection systems for advanced chip manufacturing.
Wallbox has launched Pulsar Pro for metered EV charging deployments. The AC charger integrates MID-certified measurement, reimbursement reporting, RFID access, load balancing, solar integration, and remote management for European installations.
Imec has demonstrated ferroelectric memory advances for future AI systems. The work targets density, voltage, endurance, and three-dimensional integration as AI compute architectures increase pressure on memory systems.
Rapidus has signed a UK agreement on semiconductor manufacturing collaboration. The MoU links UK semiconductor strategy with Japan’s advanced 2nm logic manufacturing plans.
Synopsys has released Multiphysics Fusion tools for chip design closure. The flows integrate timing, power, thermal, electromagnetic, multi-die, analogue, and photonic analysis.
AMD and Rackspace are scaling dedicated compute for enterprise AI. The 30MW rollout combines Instinct GPUs and EPYC CPUs for governed workloads.