Category: Electronics
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Microchip has introduced a radiation-tolerant clock generator for spacecraft systems. The DSA504RT provides six programmable outputs for low-jitter aerospace and defence timing.
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Inelco Hunter has added Amphenol liquid-cooling connectors for power-dense systems. The range targets AI data centres, EV charging, storage, and energy infrastructure.
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SEMI will centre its materials conference on AI-era semiconductor constraints. The programme covers materials, packaging, quantum devices, manufacturing scale-up, and supply resilience.
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Micron and Anthropic are linking AI infrastructure to memory architecture. Their agreement covers HBM, DRAM, SSDs, supply, and workload-level optimisation.
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IBM has demonstrated sub-one-nanometre chip technology using a nanostack architecture. The research targets future gains in logic density, SRAM scaling, and energy efficiency.
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Acbel is bringing integrated EV power conversion systems to Munich. The showcase includes 400V and 800V onboard charger and DC/DC converter architectures.
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Infineon has started production of its RASIC CTRX8188F radar transceiver. The 8Tx8Rx MMIC supports centralised ADAS architectures, 4D imaging radar, and scalable vehicle sensing platforms.
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Quantinuum and HPE are linking quantum systems with HPC infrastructure. The collaboration covers architectures, workflows, interoperability, benchmarking, and customer use cases.
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Europe is keeping advanced chip manufacturing in its policy frame. Chips Act 2.0 links logic, memory, packaging, design, and industrial demand.
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AlixLabs has launched Sax Forma for advanced semiconductor patterning workflows. The platform brings atomic pitch splitting into customer evaluation and process validation.