Category: Markets
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Memory capital spending is being pulled upward by AI demand. SEMI expects 300mm memory equipment investment to exceed $50bn in 2026, with DRAM and 3D NAND spending rising sharply.
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AI infrastructure management is becoming a rack-level electronics discipline now. KAYTUS has launched KSManage Ultra to monitor compute, power, networking, cooling, racks, and clusters.
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Low-power wireless prototyping is moving closer to final products now. Nordic’s nRF54L15 Tag combines Bluetooth Channel Sounding, sensors, NFC, Matter, Thread, and edge-AI support.
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Rail inspection data is outgrowing manual depot transfer methods now. Westermo, Eviden, and Blu Wireless have demonstrated multi-gigabit mmWave train-to-ground communications for Deutsche Bahn.
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Sequencing hardware is becoming a semiconductor sensor problem again today. Roche’s AXELIOS 1 combines SBX chemistry, nanopores, reusable CMOS modules, and near real-time analysis.
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Power IC integration is moving further onto engineered substrates now. Soitec and ZenSemi will scale 300mm BCD-on-SOI production for AI, EV, robotics, storage, and industrial systems.
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TDK has introduced 3D Hall switches for compact drive applications. HAL 13xy targets motor speed and direction sensing.
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Ubotica has raised funding to scale orbital maritime intelligence services. Live Maritime Intelligence uses onboard AI and autonomous satellite tasking.
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Code Metal has expanded its RF engineering capability through acquisition. Signal Processing Technologies adds SDR, spectrum sensing, and DSP expertise.
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Vishay has introduced high-isolation optocouplers for 800V electric vehicle systems. VOLA617A targets chargers, converters, battery management, and industrial automation.