Zollner has expanded its Zandt headquarters with new capacity. The building adds high-precision mechanics, cleaning, coating, and defence-related manufacturing capability.
Cicor has secured a major French defence electronics assembly programme. The award gives its French operation new electronic assembly work with revenue potential above €50m.
Blueshift is presenting PhaseBlue circuit material for RF PCB designs.
QPT has launched qDesign for AI-optimised power module packaging workflows.
ODU has supplied mass interconnects for automated DEIF converter testing.
Fraunhofer IAF is demonstrating GaN power modules for bidirectional charging.
Infineon will supply SiC modules for Siemens semiconductor circuit breakers.