GlobalFoundries and MPS will move power processes into Singapore production. The long-term agreement transfers proprietary MPS technology to a 300mm fab, with volume output for automotive, industrial automation, robotics, AI, and cloud applications targeted from early 2027.
Pickering reports substantially lower thermal EMF from Series 120 relays. Controlled testing recorded a 46.4µV final offset magnitude against 402.6µV for a comparable 4mm-class device after 600 seconds of coil energisation.
SolarEdge and Infineon are developing semiconductor protection for 800VDC distribution. Their solid-state circuit-breaker architecture uses silicon carbide JFET technology to target microsecond fault isolation between high-voltage conversion equipment and increasingly power-dense AI compute racks.
Elmos secures 130nm wafer capacity from SK keyfoundry through 2037. The agreement extends an 18-year foundry relationship and supports a new automotive platform beginning with the E550.01 four-channel eFuse controller and a planned compact eFlash memory cell.
Qualcomm and Amazon are collaborating on custom AI silicon platforms. The programme also covers optical connectivity extending to 1.6T.
SEMI wants Chips Act 2.0 support across Europe’s semiconductor chain. Nine proposals address investment, operating costs, governance, resilience, and workforce capacity.
Intel says High-NA EUV now supports selected volume-production layers today. More than one million wafers span certification, development, and manufacturing activity.