Category: Markets
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GDPR’s eighth anniversary puts IoT security design back under scrutiny. As connected device fleets expand, compliance is increasingly tied to secure identity, encrypted data, update support, supplier assurance, and lifecycle risk management.
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Philips has cleared a redesigned reusable pulse-oximetry sensor for America. Revised optical engineering and broader validation produced improved measurement consistency across evaluated patient groups.
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GÖPEL has automated boundary-scan programme generation within CASCON 4.11 software. The release also expands analogue measurement, netlist analysis, and processor-emulation functions.
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Infineon’s PSoC Edge kit unifies processing, sensing, and wireless connectivity. The platform supports multimodal edge-AI development across industrial, medical, wearable, and robotic systems.
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NXP’s i.MX 95 processors are now entering wider distribution channels. The platform combines heterogeneous Arm processing, neural acceleration, security, and high-speed industrial connectivity.
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IQE has raised revenue guidance as photonics demand accelerates sharply. Indium-phosphide wafers for AI data centres are leading the recovery.
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SEMI expects semiconductor equipment sales to maintain growth through 2028. AI investment is lifting wafer fabrication, memory, test, assembly, and packaging.
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Speedata has selected FlexNoC interconnect IP for its Callisto processor. The analytics accelerator moves Spark, ETL, and AI preparation into silicon.
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Murrelektronik has expanded decentralised connectivity across modular industrial automation architectures. The portfolio combines IO-Link, functional safety, field power, and industrial networking.
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AAEON has validated rugged GMSL2 cameras for edge-AI deployments worldwide. The configuration connects eight IP67 cameras to Jetson AGX Orin computing.