Category: Markets
-
CSEM and Miromico combine edge AI with industrial wireless nodes. The battery-powered design analyses sensor data locally before transmitting selected information through LoRa or mioty networks.
-
Verasonics has expanded international protection for its ultrasound transceiver architecture. New grants cover five countries, while a US provisional filing extends active-clamp work around high-voltage transmission and concurrent receive measurements.
-
Electroninks has formed an advanced packaging partnership with two suppliers. EMD Electronics will establish an application laboratory at Qualipoly to accelerate conductive-material qualification and process development.
-
Syrma SGS Elemaster has opened a new Bengaluru electronics plant. The 20,000 sq ft facility combines SMT, through-hole, and box-build assembly for high-reliability industrial, medical, transport, and energy applications.
-
MIPS has launched three workload-native platforms for physical AI development. Acies targets inference, Actus real-time event processing, and Aegis safety-oriented mission-critical systems.
-
QuickLogic has expanded eFPGA hard IP for GlobalFoundries 12LP technology. The architecture now scales beyond 250,000 LUTs while adding enhanced DSP functions and optional configuration-bit error monitoring.
-
Innolux has unveiled Chip-Last FOPLP for advanced semiconductor packaging production. Its HIPoS platform uses 620 × 670mm panels and targets 2/2µm redistribution-layer geometry ahead of planned 2027 mass production.
-
TT Electronics has raised expectations after first-half profitability improved sharply. Cleveland is profitable again, Components has returned to profit, and the group expects 2026 adjusted operating profit to beat current market expectations.
-
The UK semiconductor sector now spans 703 active companies nationwide. Dedicated businesses generated an estimated £10.6 billion in revenue and £7.5 billion in GVA during 2025, while skills, scale-up finance, and energy costs remain barriers.
-
IDS is expanding industrial vision across cameras, AI, and 3D. VISION 2026 demonstrations span event-based sensing, embedded multicamera processing, time-of-flight depth capture, and edge inference.