Category: Products
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FS has launched its 800G D7070 muxponder for datacentre interconnects. The 1U platform aggregates 100GbE and 400GbE services into coherent optical channels.
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Collins has completed altitude testing of the EPACS thermal system. The programme tested flight-representative power levels, emergency power, and performance models.
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Perceptia has released pPLL03 design IP for Samsung 14LPU silicon. The block supports 4GHz operation, fractional-N synthesis, low jitter, and compact SoC integration.
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SiFive has launched rackable RISC-V hardware for datacentre development workloads. BigSky combines 32 P870-D cores with DDR5, PCIe 5.0, Linux, and GPU support.
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Intel has detailed three architectures spanning datacentre, inference, and edge. Diamond Rapids, Crescent Island, and Wildcat Lake combine new compute, memory, packaging, and interconnect technologies.
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Emerson will supply Equinor measurement technology under long-term framework agreements. The scope covers instrumentation, analytical systems, and lifecycle services across global assets.
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STMicroelectronics and NUS have opened a four-year edge-AI research laboratory. HELIX will develop memory-centric architectures, accelerators, and silicon implementations for physical AI.
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Infineon is acquiring C2i to expand AI power management capabilities. The deal adds software-defined multiphase control expertise for denser processor power architectures.
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Yokogawa has introduced split-core sensors for high-current power measurement applications. The 200A and 500A devices combine clamp-on installation with wide bandwidth for inverter and energy-system testing.
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Researchers have improved weak-field GaN LEDs on manufacturable c-plane substrates. Digital-alloy quantum barriers reduced polarisation while preserving an industrial MOCVD-compatible epitaxial route.