Aeonsemi has launched compact all-silicon oscillators for constrained electronics designs. ArcadiumNano extends the company’s quartz-free timing architecture into packages down to 1.2 × 1.0mm, with lower power, wider temperature options, and integrated spread-spectrum control.
EPC has started volume production of four integrated GaN stages. The 100V devices combine high-side and low-side transistors, gate drivers, level shifting, and protection for compact motor-drive and power-conversion designs.
AWS and NVIDIA will deploy two million additional GPUs globally. The programme extends through Blackwell Ultra, Rubin and Rubin Ultra hardware, Vera CPUs, NVLink Fusion, custom high-bandwidth memory, government infrastructure, and robotics.
SK hynix has broken ground on its Indiana HBM facility. The $4 billion project combines advanced packaging, testing, and an R&D testbed, with cleanroom opening targeted for 2028 and mass production in 2029.
PewCB has introduced a desktop system for rapid PCB prototyping. PewCB One combines laser ablation, prepared two-sided ceramic blanks, and stencil cutting to shorten hardware iteration cycles.
Vishay has expanded automotive chokes for compact high-current EMC filtering. Four AEC-Q200 devices combine currents to 14A, impedance to 11kΩ, and DCR as low as 0.4mΩ.
KYOCERA AVX has launched vibration-proof capacitors for harsh industrial environments. The AEVA and AEVB families withstand acceleration to 30g while operating at temperatures reaching 125°C.