Category: Products
-
Philips has cleared a redesigned reusable pulse-oximetry sensor for America. Revised optical engineering and broader validation produced improved measurement consistency across evaluated patient groups.
-
Europe’s processor programme has completed its second major development stage. Demonstrations covered Rhea1 silicon, RISC-V acceleration, scientific software, design tools, and memory compression.
-
Infineon’s PSoC Edge kit unifies processing, sensing, and wireless connectivity. The platform supports multimodal edge-AI development across industrial, medical, wearable, and robotic systems.
-
NXP’s i.MX 95 processors are now entering wider distribution channels. The platform combines heterogeneous Arm processing, neural acceleration, security, and high-speed industrial connectivity.
-
Researchers have demonstrated efficient perovskite LEDs using vacuum deposition techniques. Controlled crystallisation produced 21.9% efficiency alongside narrow, high-purity light emission.
-
Microsoft will deploy AMD’s Helios rack architecture across Azure infrastructure. New processor-led virtual machines will support AI pipelines, EDA, and technical computing.
-
Texas Instruments has integrated high-voltage measurement into one signal chain. The TPS4141-Q1 combines precision attenuation, amplification, switching, and programmable measurement range.
-
SEMI expects semiconductor equipment sales to maintain growth through 2028. AI investment is lifting wafer fabrication, memory, test, assembly, and packaging.
-
Speedata has selected FlexNoC interconnect IP for its Callisto processor. The analytics accelerator moves Spark, ETL, and AI preparation into silicon.
-
AAEON has validated rugged GMSL2 cameras for edge-AI deployments worldwide. The configuration connects eight IP67 cameras to Jetson AGX Orin computing.