Category: Products
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MediaTek has expanded NVLink Fusion work for custom accelerator programmes. The collaboration adds advanced packaging, HBM integration, rack-scale interconnect, and a $3.5 billion investment.
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Teradyne has added three instruments for advanced AI semiconductor testing. UltraFLEXplus gains deeper digital patterns, PCIe Gen6 coverage, and multi-kiloamp power delivery.
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Qualcomm has launched IQ-2390 for compact industrial edge computing platforms. The processor combines AI, vision, TSN networking, real-time control, and long-lifecycle support.
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Solinide has launched LumiCOMB as a commercial optical comb source. The 2U instrument provides coherent O-band or C-band wavelength lines for photonics development.
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MetaX has moved its C600 accelerator into commercial mass production. Rising GPU shipments lifted first-half revenue 44.67%, while the 1,000W OAM 2.0 module adds high-bandwidth memory, ECC, and MetaXLink scaling for systems of up to 128 GPUs.
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EugenLight has launched high-power external lasers for emerging CPO systems. The ELSFP modules combine low-loss connectors, polarisation-maintaining fibre, hot-pluggability, and a production roadmap targeting volume manufacture during early 2027.
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FSP has introduced dual-voltage 3.2kW CRPS modules for AI systems. Separate 12V and 54V versions combine Titanium efficiency, PMBus telemetry, redundant operation, and short-duration peak-power capability for increasingly dense accelerator hardware.
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CXMT has moved its LPDDR6 memory technology into volume production. The Chinese DRAM manufacturer specifies speeds reaching 12,800Mbps and capacities up to 16GB, with Xiaomi providing the first announced deployment.
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sensiBel has pushed optical MEMS microphone performance to new levels. The SBM140B combines 84dBA SNR, 146dB SPL acoustic overload capability, and 24-bit digital output, with production scheduled for the first quarter of 2027.
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AMD will power Finland’s €387.8m LUMI-AI supercomputer with next-generation silicon. Instinct MI430X GPUs and 256-core sixth-generation EPYC processors underpin a BullSequana XH3500 system scheduled for deployment during 2027.