Category: Products
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Siemens has developed an AI data-centre reference design. The architecture covers electrical distribution, controls, modular power blocks, storage integration, and scalable deployment for NVIDIA Vera Rubin NVL72 infrastructure.
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ST has launched a vibration sensor for industrial condition monitoring systems. The IIS3DWB10IS combines MEMS sensing, wide-bandwidth measurement, and local AI processing for predictive maintenance applications.
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Pickering will show EV test systems for battery electronics validation.
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Molex has introduced liquid-cooled busbars for high-current AI racks globally.
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Microchip has released PCIe and CXL retimers for AI fabrics.
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Frenetic has appointed SZ Dore to support Asian magnetics customers.
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Danisense will launch a 4000A fluxgate transducer at PCIM Europe.
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Toshiba has launched a compact complementary MOSFET for motor-control designs.
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Tobii is providing webcam-based eye tracking for Lenovo’s tablet. The Legion Y900 13 uses Tobii Nexus software on a Qualcomm SoC to support multimodal AI interaction.
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ByteSnap Design will demonstrate embedded edge-AI vision at UK events. The system runs real-time object detection on embedded hardware without cloud processing, using an Infineon PSOC Edge device.