Category: Products
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NXP has integrated analogue radio and AI audio processing together. The SAF9800 combines reception, DSP, neural inference, and accelerated filtering functions.
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Astute has added UTA modules as memory shortages spread upstream. The agreement gives embedded developers additional cellular and positioning options during constrained supply.
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IBASE has combined 99 TOPS with expandable industrial connectivity options. Its compact edge computer targets machine vision, automation, and local inference deployments.
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Samsung and Broadcom are aligning memory, foundry, and packaging roadmaps. Their expanded agreement joins HBM supply with advanced-node manufacturing and heterogeneous integration.
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AMD has combined heterogeneous processing within a production-ready robotics platform. CPU, GPU, NPU, and programmable-logic resources support perception, planning, inference, control, and industrial connectivity.
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DigiKey and Machinechat have combined sensors, hardware, and local software. The rapid engineering kit turns environmental measurements into dashboards, storage, and alerts.
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Mouser now stocks TI’s compact UCC33420-Q1 isolated DC-DC power module. The 1.5W device integrates its planar transformer and switching stage.
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Kioxia has begun sampling 332-layer tenth-generation BiCS Flash memory devices. Direct wafer bonding raises density and interface speed while reducing read and write power.
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GigaDevice has entered the industrial EEPROM market with GD24CL devices. Endurance reaches four million write cycles, with retention specified at 100 years.
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Ultralytics has optimised YOLO26 models directly for Intel edge processors. OpenVINO deployment spans CPUs, integrated GPUs, and NPUs for industrial vision.