Category: Products
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Semiconductor revenue reached $319bn during the first quarter of 2026. Omdia’s figures show an exceptional memory rebound, with DRAM and NAND nearly doubling as AI infrastructure demand reshapes chip-market growth.
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Quobly has raised €115m for silicon quantum computing systems development. The funding supports 300mm wafer processes, FD-SOI technology, and a full-stack architecture spanning qubits, control electronics, and software.
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Molex has added 25A power modules to AirBorn SInergy connectors. The hybrid platform combines power, RF, and high-speed data.
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Analogue Insight has opened engagement for low-power 32Gbps interconnect IP. The design targets co-packaged optics and silicon photonics.
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IQE and Tower have signed a multi-year InP epiwafer agreement. The supply deal supports silicon photonics for AI infrastructure.
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CEA-Leti has demonstrated denser 22nm FeRAM using vertical HZO capacitors. The work targets embedded non-volatile memory for edge AI.
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Nexperia has reported resilient first-quarter results despite supply disruption pressures. Back-end expansion is advancing in Malaysia and the Philippines.
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Toshiba has developed a higher-voltage press-pack IEGT chip for converters. The 6500V device targets HVDC, STATCOM, and industrial motor drives.
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Imec, ASML, and TSMC have demonstrated industry-scale 2D transistor integration. The 300mm work points beyond silicon logic scaling.
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TDK has introduced B25696H DC-link capacitors for SiC converter designs. The MKP film series targets high-frequency power stages across storage, traction, renewables, and drives.