Category: Products
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MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
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Anritsu has introduced Tensor, an AI-assisted vector network analyser platform. The source-per-port architecture supports RF, microwave, millimetre-wave, and sub-THz characterisation.
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NeoCortec is bringing NeoMesh into Endrich’s e-IoT platform for sensors. The wireless mesh layer supports low-power industrial nodes, gateways, and monitoring systems without new cabling.
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ROHM has introduced TSC3PAK for top-side-cooled SiC MOSFET power packages. The package combines surface-mount assembly with insulation and thermal performance for high-voltage power conversion.
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Thales will supply 60 GO12 radar systems to Germany’s Bundeswehr. The order adds mobile 360-degree ground surveillance for drone and vehicle detection in adverse weather.
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Imec has advanced its 300mm RF silicon interposer platform further. The work adds embedded capacitors, passive modelling, and laser-assisted bonding for III-V chiplets on Si-CMOS.
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Qorvo has introduced its compact X-band radar front-end module package. The QPF5012 combines power, efficiency, and receive sensitivity for arrays.
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Altera is now sampling Agilex 9 Direct RF-Series SoC FPGAs. The devices integrate converters, programmable logic, processing, memory, and RF capability.
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MAHLE and Rohde & Schwarz have combined calibration with radar. The system verifies ADAS sensor alignment and function after vehicle repairs.
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Siemens and Samsung Foundry are extending advanced-node EDA collaboration flows. The work covers verification, test, packaging, analogue, RF, and implementation.