Everspin Technologies has completed production qualification of its 64Mb high-reliability xSPI MRAM, extending the use of persistent memory in industrial, medical, aerospace, and other applications requiring robust operation under extreme conditions.
Belden has launched a new virtual firewall and digital I/O modules for industrial environments, expanding its portfolio for converged IT and OT networks as manufacturers look to improve segmentation, resilience, and field-level connectivity.
LurexX is licensing IMSE to model and validate in-mold lighting. The partnership adds optical simulation and measurement to TactoTek’s smart-surface ecosystem, supporting dynamic surface illumination and light lines within ultra-thin moulded structures.
ST’s STM32C5 puts Cortex-M33 performance into entry-level designs everywhere today. A 40nm platform, up to 1MB Flash, and security features bring faster control and richer connectivity into cost-sensitive smart devices.
Holyvolt has bought Wildcat to speed battery chemistry to scale. The $73m deal ties high-throughput materials discovery to screen-printed, water-based manufacturing aimed at faster pilot production and lower-cost industrialisation in Europe and North America.
Dymax will demo UV curing workflows at APEX EXPO 2026. The booth programme centres on PCB-level adhesives, coatings, and maskants, pairing automated dispensing with UV/LED curing demonstrations aimed at reliability challenges including outgassing, component stability, and environmental protection.
Teledyne releases wideband limiter to protect EW receiver front-ends hardware. The passive 0.1–20 GHz module is built to absorb high-power RF before it reaches sensitive electronics, with SMA connectors and fast recovery aimed at retrofit protection in R-ESM and EW systems.