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Rapidus signs UK semiconductor centre agreement

Rapidus signs UK semiconductor centre agreement

Synopsys releases Multiphysics Fusion tools

Synopsys releases Multiphysics Fusion tools

Taiwan Semiconductor adds TQM MOSFETs

Taiwan Semiconductor adds TQM MOSFETs

Toshiba adds MOSFETs for 48V systems

Toshiba adds MOSFETs for 48V systems

Kontron launches rugged TSN defence switch

June 19, 2026
Xiphera joins Finnish secure SoC programme

June 19, 2026
HMS launches rugged industrial Ethernet switches

June 19, 2026
IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic

June 19, 2026
Robin Radar extends drone sensing to sea

June 19, 2026
u-blox adds European wireless modules

June 19, 2026
Agile Analog and Xiphera combine chip security

June 18, 2026
TE sensors reach Mouser for isolation designs

June 18, 2026

Latest industry news

IQE signs InP supply deal with Tower

16/6/2026

IQE and Tower have signed a multi-year InP epiwafer agreement.…
CEA-Leti scales FeRAM to 22nm

16/6/2026

CEA-Leti has demonstrated denser 22nm FeRAM using vertical HZO capacitors.…
Fraunhofer urges faster technology transfer

16/6/2026

Fraunhofer has urged Germany to accelerate applied research-to-industry technology transfer.…
Nexperia reports resilience despite supply disruption

16/6/2026

Nexperia has reported resilient first-quarter results despite supply disruption pressures.…
Toshiba develops 6500V press-pack IEGT chip

16/6/2026

Toshiba has developed a higher-voltage press-pack IEGT chip for converters.…
Imec advances 300mm 2D transistor integration

16/6/2026

Imec, ASML, and TSMC have demonstrated industry-scale 2D transistor integration.…

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Featured

IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic
The manufacturing challenge facing scaling UAV developers
Building traceability and control in battery manufacturing
The trials and tests of the best available adhesive
Dismantled: March 2026

Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Jun 18

2026

The manufacturing challenge facing scaling UAV developers
Jun 16

2026

Building traceability and control in battery manufacturing
Jun 15

2026

The trials and tests of the best available adhesive
Apr 8

2026

Dismantled: March 2026
Mar 4

2026

Dismantled: February’s electronics bottlenecks moved further downstream
Feb 20

2026

AI inference pushes NAND supply into constraint

Electronics

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Rapidus signs UK semiconductor centre agreement

Rapidus has signed a UK agreement on semiconductor manufacturing collaboration.…

Synopsys releases Multiphysics Fusion tools
AMD and Rackspace scale enterprise AI
The manufacturing challenge facing scaling UAV developers
Microchip adds Class Y in Nantes
Memory surge pushes chip market past $319bn

Design engineering

—

Rapidus signs UK semiconductor centre agreement

Rapidus has signed a UK agreement on semiconductor manufacturing collaboration.…

Synopsys releases Multiphysics Fusion tools
Xiphera joins Finnish secure SoC programme
IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic
Agile Analog and Xiphera combine chip security
Keysight adds wideband RF signal analysers

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