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Axiro backs ThinSiC power semiconductor development

Axiro backs ThinSiC power semiconductor development

Renesas reports ¥435bn third-quarter chip revenue

Renesas reports ¥435bn third-quarter chip revenue

IBASE launches compact Core Ultra edge computer

IBASE launches compact Core Ultra edge computer

SinceVision introduces wide-spot laser displacement sensor

SinceVision introduces wide-spot laser displacement sensor

Axiro backs ThinSiC power semiconductor development

November 2, 2026
Renesas reports ¥435bn third-quarter chip revenue

November 2, 2026
IBASE launches compact Core Ultra edge computer

November 2, 2026
SinceVision introduces wide-spot laser displacement sensor

November 2, 2026
BrainChip launches AKD1500 Raspberry Pi 5 kit

November 2, 2026
Omron starts medical device production at Chennai factory

November 2, 2026
Euroquartz adds high-power cavity filters to US distribution

November 2, 2026
STMicroelectronics reports higher sales and semiconductor margins

November 2, 2026

Latest industry news

Rehm combines three methods for heavy PCB reflow

30/10/2026

Rehm combines convection, condensation and vacuum in complex PCB soldering.…
Kontron and NOFFZ automate 5G module testing

30/10/2026

Kontron and NOFFZ automate production testing of German 5G modules.…
ifm introduces LDH313 compressed-air dew-point sensor

29/10/2026

ifm has introduced its LDH313 sensor for dew-point monitoring applications.…
UbiQD secures funding for single-photon development

29/10/2026

UbiQD has secured funding for a fibre-coupled single-photon source prototype.…
ASMPT reports record semiconductor equipment orders

29/10/2026

ASMPT recorded unprecedented orders for semiconductor and electronics manufacturing equipment.…
EPC launches GaN motor-drive evaluation boards

29/10/2026

EPC has launched two GaN evaluation boards for motor control.…

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Featured

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Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Oct 5

2026

Dismantled: Q3 2026
Oct 5

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Security by design: why organisations need to secure IoT ahead of deployment
Aug 10

2026

The race to move AI data at the speed of light
Jul 23

2026

GDPR and the transformation of IoT security
Jul 17

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AI brings real-time intelligence to medical electronics
Jul 14

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High-power delivery for industrial AI-ready networks

Electronics

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Cardiff and Swansea plan semiconductor pilot foundry

Cardiff and Swansea universities are examining joint semiconductor foundry capabilities.…

Syrma SGS reports record electronics manufacturing revenue
Axiro backs ThinSiC power semiconductor development
Renesas reports ¥435bn third-quarter chip revenue
Omron starts medical device production at Chennai factory
STMicroelectronics reports higher sales and semiconductor margins

Design engineering

—

Cardiff and Swansea plan semiconductor pilot foundry

Cardiff and Swansea universities are examining joint semiconductor foundry capabilities.…

VIAVI connects AI agents to network testing
Axiro backs ThinSiC power semiconductor development
Euroquartz adds high-power cavity filters to US distribution
Würth details press-fit copper busbars for PCBs
Rohde & Schwarz adds AI control to oscilloscopes

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