Category: News
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Vishay has launched flat-clamping TVS devices for high-power protection circuits. XFD11KxxCA spans 33V-to-85V stand-off ratings with AEC-Q101 options for automotive, industrial, server, storage, and telecom power systems.
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ROHM has raised 0402 resistor power density to 0.33W operation. The SDR01 series combines higher power handling with anti-surge performance for dense automotive, industrial, consumer, and AI-server electronics.
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South Korea is widening espionage law around foreign technology theft. The revised Criminal Act takes effect on 13 September as semiconductor know-how becomes an increasingly prominent industrial-security concern.
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Vicor is acquiring two New Hampshire sites for ChiP fabs. Fab-2 and Fab-3 could add nearly one million square feet as its existing Andover power-module operation approaches capacity.
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Renesas has expanded its RZ/G family with two scalable MPUs. RZ/G3L and RZ/G3SE combine Cortex-A55 processing, Cortex-M33 control, industrial connectivity, and low-power Linux standby on a pin-compatible hardware platform.
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Singular Photonics has launched Litavis, a programmable multimodal SPAD sensor. The Edinburgh-developed device combines photon counting, timing, histogramming, and statistics on-chip while reducing external processing requirements.
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Chess Dynamics has launched CHARM50 for compact edge video processing. The low-SWaP module combines AI-enabled detection, classification, and tracking with local video processing for distributed electro-optical sensor architectures.
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Keysight has joined EuroCDP to widen European startup EDA access. The agreement brings RF, electromagnetic, high-speed digital, device-modelling, training, and design-data tools into the Chips Act-backed platform.
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Taiyo Holdings has demonstrated 700nm RDL features on 300mm wafers. The three-layer structure uses its FPIM photosensitive dielectric for dual-damascene processing, with both interconnects and vias reaching the target dimension.
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GomSpace has secured a $2.4m US defence satellite platform order. The contract covers modular 6U-to-16U CubeSat and microsatellite-class kits for an undisclosed government mission, with deliveries due over coming quarters.