ST has added a compact vibration sensor for industrial monitoring.
Silicon wafer shipments rose sharply as AI demand widened globally.
CEA-Leti will focus its summit on sustainable AI semiconductors.
Microchip has opened a new Tuscaloosa facility to increase production of its MHM-2020 Active Hydrogen Maser and reduce lead times for precision timing systems.
ROHM has developed the ML7670 and ML7671 NFC wireless power chipset for compact wearables, including smart rings, smart bands, and smart pens.
onsemi and Geely Auto Group have expanded their collaboration around EliteSiC power technologies for next-generation electric and hybrid vehicle platforms.
Amphenol RF has expanded its non-magnetic MCX connector series with new configurations for medical equipment, quantum computing hardware, and wireless modules.
Teledyne FLIR Defense has certified Emesent’s Hovermap LiDAR payload for unmanned air, ground, and radiation-detection platforms, adding GPS-denied 3D mapping capability.