Global semiconductor sales accelerated sharply during the second quarter again. Revenue reached $403.3 billion, while European June sales increased 75.2% year on year.
TrendForce expects DRAM constraints to reshape future HBM configurations significantly. Accelerator developers are evaluating lower-capacity options as supply and validation pressures persist.
Power Integrations has demonstrated gallium nitride technology rated at 2200V. The platform extends PowiGaN towards higher-voltage data centre, vehicle, renewable-energy, and HVDC conversion.
Wolfspeed silicon carbide is qualified for LITEON’s 800VDC power platforms. The partnership links SiC device supply with rack and sidecar systems for hyperscale AI data centres.
Molex has combined power and Ethernet within one miniature connector. MiniMix targets compact robotic joints where separate interfaces complicate routing and assembly.
AI data centre demand lifted Infineon to record quarterly revenue. Power & Sensor Systems led the increase as server and data centre orders strengthened.
Vishay’s order intake strengthened across semiconductor and passive component markets. Backlog reached 6.1 months as bookings exceeded shipments across most product groups.