Category: Products
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Leankon has widened its NFC antenna range to nine modules. The expanded 13.56 MHz line packages ferrite-backed, connector-ready options into a broader off-the-shelf portfolio for healthcare, access control, and industrial IoT hardware.
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Teradyne is pushing board test further into AI server manufacturing. Omnyx combines structural, parametric, high-speed interconnect, and operational test in one platform for complex data-centre hardware.
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Europe’s ferroelectric memory push has reached an important manufacturing test. CEA-Leti and Fraunhofer IPMS have completed the first wafer exchange inside the FAMES pilot line for HZO-based memory stacks.
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Synaptics is shrinking edge AI and wireless into one chip. The SYN765x integrates Wi‑Fi 7, Bluetooth LE 6.0, Thread/Zigbee, sensing, and local processing for low-power smart devices.
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TI is compressing AI rack power delivery into two stages. The architecture tracks NVIDIA’s 800 VDC roadmap and pushes higher density, fewer conversions, and lower copper overhead into the datacentre power chain.
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Coherent is scaling InP photonics for faster AI data links. Its OFC 2026 lineup spans lasers, modulators, photodiodes, and subsystems aimed at 1.6T and 3.2T optical architectures.
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Samsung and AMD tighten HBM4 planning around rack-scale AI systems. Their expanded agreement links next-generation high-bandwidth memory supply to future Instinct accelerators, where bandwidth, packaging, power, and platform integration are now moving together.
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UK lighting faces rising WEEE scrutiny as marketplace data deepens. Fresh reporting is sharpening the scale of non-compliance across online lighting sales, increasing pressure on registration, traceability, classification, and end-of-life obligations.
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Digi extends remote telemetry into harsher and less connected sites. Its Connect Sensor XRT-M combines LTE-M and NB-IoT connectivity, MQTT support, edge processing, and ruggedised deployment for remote industrial monitoring without fixed local infrastructure.
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Microchip targets harsher power stages with ruggedised silicon carbide packaging. Its new BZPACK mSiC modules combine HV-H3TRB endurance, broad topology options, and a baseplate-less assembly approach for industrial and renewable energy power-conversion designs.