Switzerland’s photonics manufacturing base is moving toward industrial production scale. CCRAFT has raised $7.8m to expand thin-film lithium niobate chip manufacturing in Neuchâtel.
AI infrastructure is tightening board-level power delivery and thermal limits. Flex Power Modules has introduced the BMR353 eighth-brick intermediate bus converter for high-density data-centre designs.
Backend semiconductor capacity is moving into the design conversation fast. SEMI and TechSearch International have expanded their assembly and test database to cover more than 820 global facilities.
Infineon will supply SiC devices for ADVANTICS power converters today. The platform targets megawatt charging, storage, microgrids, and data centres.
IMRA America has demonstrated a higher-stability THz source architecture today. The 260GHz system combines electronic oscillation with optical reference locking.