Infineon has joined NVIDIA’s MGX ecosystem for AI rack power. The collaboration supports 800VDC architectures using silicon, silicon carbide, and gallium nitride technologies to improve power delivery in high-density AI data centres.
Vishay has expanded its IHXL inductor range for high-current designs. The new automotive-grade and commercial devices offer current ratings up to 209A, lower core losses, and operation to +155°C.
iDEAL Semiconductor will showcase SuperQ silicon MOSFET technology at PCIM. The architecture targets lower conduction and switching losses while keeping designers within familiar silicon manufacturing, packaging, and qualification routes.
Rambus has introduced a DDR5 9600 client memory module chipset for CUDIMM, CQDIMM, and CSODIMM designs in future AI PCs, workstations, and notebooks.
Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.
P&N Europe is offering compact thermoelectric coolers for optical transceiver assemblies, targeting laser temperature stability in high-speed data centre, AI, telecom, and coherent optical links.