Category: Products
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ROHM has detailed fifth-generation SiC MOSFETs for power conversion systems. The devices target lower losses and higher density in automotive, server, and industrial applications.
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SiTime has completed its acquisition of Renesas’ timing business unit. The deal expands precision clocking capacity for AI, communications, automotive, and industrial electronics.
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Lauterbach has added TRACE32 support for NXP CoolFlux DSPs development. The update extends debug and non-intrusive trace coverage for low-power signal-processing systems.
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Rutronik is offering Intel processors for physical AI systems deployments. The devices combine CPU, GPU, and NPU resources for robotics and automation.
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MediaTek and Samsung have advanced five-layer 5G uplink performance testing. The demonstration reached 670Mbps using MediaTek’s M90 modem and Samsung’s vRAN and radio systems.
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Sony Semiconductor has joined MIPI’s board as a Promoter member. The move strengthens image-sensor input into interface standards used across embedded vision, automotive, IoT, and mobile-influenced systems.
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Advantech has added Dragonwing IQ9 systems for industrial edge AI. The portfolio spans modules, robotic controllers, and fanless platforms for vision intelligence.
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Q2 2026 made electronics design constraints much harder to ignore. Memory, packaging, optics, EDA automation, edge AI, and power delivery all carried forward existing pressures, while adding sharper evidence of how advanced systems are now limited by more than processors alone.
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FORTEC UK has expanded the compact Delta medical power range. The MEP-500A family now includes open-frame, enclosed, and top-fan cooled 500W models.
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Dynex Semiconductor has developed a high-current 650V GaN power module. The 450A half-bridge design uses PCB embedding and double-sided cooling for dense industrial power conversion.