Category: Products
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Belden has launched a new virtual firewall and digital I/O modules for industrial environments, expanding its portfolio for converged IT and OT networks as manufacturers look to improve segmentation, resilience, and field-level connectivity.
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LurexX is licensing IMSE to model and validate in-mold lighting. The partnership adds optical simulation and measurement to TactoTek’s smart-surface ecosystem, supporting dynamic surface illumination and light lines within ultra-thin moulded structures.
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Microchip’s LX4580 consolidates actuation sensing and control into one IC. The 24-channel mixed-signal device targets aviation and defence actuators with redundant architecture, multi-sensor interfaces, and evaluation tools to cut board size, wiring, and integration effort.
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ST’s STM32C5 puts Cortex-M33 performance into entry-level designs everywhere today. A 40nm platform, up to 1MB Flash, and security features bring faster control and richer connectivity into cost-sensitive smart devices.
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Holyvolt has bought Wildcat to speed battery chemistry to scale. The $73m deal ties high-throughput materials discovery to screen-printed, water-based manufacturing aimed at faster pilot production and lower-cost industrialisation in Europe and North America.
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Dymax will demo UV curing workflows at APEX EXPO 2026. The booth programme centres on PCB-level adhesives, coatings, and maskants, pairing automated dispensing with UV/LED curing demonstrations aimed at reliability challenges including outgassing, component stability, and environmental protection.
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Teledyne releases wideband limiter to protect EW receiver front-ends hardware. The passive 0.1–20 GHz module is built to absorb high-power RF before it reaches sensitive electronics, with SMA connectors and fast recovery aimed at retrofit protection in R-ESM and EW systems.
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ifm’s O6D100 tackles black, reflective objects in tight spaces reliably. The PMD time-of-flight distance sensor targets logistics, robotics, and assembly automation, pairing a 3 m range with selectable speed and precision modes over IO-Link for fast retrofits.
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Vertiv has launched a double-stack busway for AI data centres. The PowerBar Track update is built to raise overhead distribution capacity while preserving white space, with live reconfiguration, optional metering, and safety interlocks aimed at fast-changing colocation and hyperscale deployments.
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ROHM is bringing TSMC GaN process know-how into Hamamatsu plant. The company plans an end-to-end in-group production system by 2027, targeting demand from AI server power supplies and EV on-board chargers.